| 1 | BWLEHKG58641113 | PRINTED CIRCUIT BOARDTHIS SHIPMENT DOES NOT CONTAIN ANY WOODPACKING MATERIALS | AMPHENOL OPTIMIZE FTZ INBOND C/O TE | SUNTAK TECHNOLOGY LTD. | 2025-05-18 | Hong Kong | 179 Kgs | 19 CTN | 
| 2 | BWLEHKG58571027 | 17CTNS PACKED INTO 1PLTCONNECTOR INVOICE# 2025IVAC012613 PO# M000087 THIS SHIPMENT DOES NOT CONTAIN ANY WOODPACKING MATERIALS | AMPHENOL OPTIMIZE FTZ INBOND C/O TE | AMPHENOL EAST ASIA LTD | 2025-04-29 | Hong Kong | 249 Kgs | 17 CTN | 
| 3 | BWLEHKG58531707 | (102CTNS PACKED INTO 3PLTS)+12CTNS | AMPHENOL OPTIMIZE FTZ INBOND C/O TE | ADVANCED CONNECTION TECHNOLOGY INC | 2025-04-21 | Hong Kong | 837 Kgs | 114 CTN | 
| 4 | BWLEHKG58537471 | 54CTNS PACKED INTO 1PLTPRINTED CIRCUIT BOARDTHIS SHIPMENT DOES NOT CONTAIN ANY WOODPACKING MATERIALS | AMPHENOL OPTIMIZE FTZ INBOND C/O TE | SUNTAK TECHNOLOGY LTD. | 2025-04-21 | Hong Kong | 519 Kgs | 54 CTN | 
| 5 | BWLEHKG58531724 | 52CTNS PACKED INTO 1PLTPRINTED CIRCUITS BOARDSTHIS SHIPMENT DOES NOT CONTAIN ANY WOODPACKING MATERIALS | AMPHENOL OPTIMIZE FTZ INBOND C/O TE | KUNSHAN HUATAO ELECTRONICS CO.,LTD | 2025-04-21 | Hong Kong | 657 Kgs | 52 CTN | 
| 6 | BWLEHKG58531718 | 72CTNS PACKED INTO 4PLTSMEATL EMI FRAME/METAL EMI COVER 73201020 M000012THIS SHIPMENT DOES NOT CONTAIN ANY WOODPACKING MATERIALS | AMPHENOL OPTIMIZE FTZ INBOND C/O TE | KUNSHAN YUKAI HARDWARE SPRING CO.,L | 2025-04-21 | Hong Kong | 642 Kgs | 72 CTN |