| 
              1
             |  
              SHKK724705417351
             |  
              LADRILLO CERAMICO
             |  
                COMPONENTES Y ENSAMBLES
               |  
                  LA PALOMA CERAMICOS
                 |  
              2014-09-30
             |  
              Spain
             |  
              46220 Kgs
             |  
              45 PKG
             | 
| 
              2
             |  
              APLU300545155   
             |  
              PRESSFIT DIODE -50A 20-24VFOR VALEOPRESSFIT DIODE -25A 20-24VFOR VALEOPRESSFIT DIODE -35A 20-24V225-C
             |  
                COMPONENTES Y ENSAMBLES
               |  
                  ACTRON TECHNOLOGY CORPORATION
                 |  
              2012-05-21
             |  
              China Taiwan
             |  
              3900 Kgs
             |  
              26 WDC  
             | 
| 
              3
             |  
              APLU300544322   
             |  
              PRESSFIT DIODE -50A 20-24VFOR VALEOPRESSFIT DIODE -25A 20-24VFOR VALEOPRESSFIT DIODE -35A 20-24V225-CPRESSFIT DIODE -50A 20-24V225-CPRESSFIT DIODE -35A 20-24V;9P-KGS=7PLTS-14W-CASES--2W-CASES
             |  
                COMPONENTES Y ENSAMBLES
               |  
                  ACTRON TECHNOLOGY CORPORATION
                 |  
              2012-05-14
             |  
              China Taiwan
             |  
              2640 Kgs
             |  
              16 WDC  
             | 
| 
              4
             |  
              APLU300543285   
             |  
              PRESSFIT DIODE -50A 20-24VFOR VALEOPRESSFIT DIODE -25A 20-24VFOR VALEOPRESSFIT DIODE -35A 20-24V225-C;9P-KGS=8PLTS-16W-CASES--1W-CASE;
             |  
                COMPONENTES Y ENSAMBLES
               |  
                  ACTRON TECHNOLOGY CORPORATION
                 |  
              2012-05-07
             |  
              China Taiwan
             |  
              2740 Kgs
             |  
              17 WDC  
             | 
| 
              5
             |  
              HLCUTPECD13916AC
             |  
              DIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -35A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -50A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFERFOR VALEODIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -25A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFERFOR VALEODIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -35A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFER225CDIODE:UNMOUNTED CHIP,DIE,WAFER34PKGS=31PLTS(62W/CASES)DIODE:UNMOUNTED CHIP,DIE,WAFER+3W/CASEDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFER
             |  
                COMPONENTES Y ENSAMBLES
               |  
                  ACTRON TECHNOLOGY CORPORATION
                 |  
              2012-04-30
             |  
              China Taiwan
             |  
              10024 Kgs
             |  
              34 PCS  
             | 
| 
              6
             |  
              HLCUTPECD06360AG
             |  
              DIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -35A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -50A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFERFOR VALEODIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -25A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFERFOR VALEODIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -35A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFER225CDIODE:UNMOUNTED CHIP,DIE,WAFER21PKGS=20PLTS(40W/CASES)DIODE:UNMOUNTED CHIP,DIE,WAFER+1W/CASEDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFER
             |  
                COMPONENTES Y ENSAMBLES
               |  
                  ACTRON TECHNOLOGY CORPORATION
                 |  
              2012-04-23
             |  
              China Taiwan
             |  
              6552 Kgs
             |  
              21 PCS  
             | 
| 
              7
             |  
              HLCUTPECC32772AF
             |  
              DIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -35A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -50A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFERFOR VALEODIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -25A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFERFOR VALEODIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -35A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFER225CDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFER
             |  
                COMPONENTES Y ENSAMBLES
               |  
                  ACTRON TECHNOLOGY CORPORATION
                 |  
              2012-04-17
             |  
              China Taiwan
             |  
              8764 Kgs
             |  
              27 PCS  
             | 
| 
              8
             |  
              HLCUTPECC22849AF
             |  
              DIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -35A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -50A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFERFOR VALEODIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -25A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFERFOR VALEODIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -35A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFER225CDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFER
             |  
                COMPONENTES Y ENSAMBLES
               |  
                  ACTRON TECHNOLOGY CORPORATION
                 |  
              2012-04-09
             |  
              China Taiwan
             |  
              5212 Kgs
             |  
              17 PCS  
             | 
| 
              9
             |  
              HLCUTPECC16781AE
             |  
              DIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -35A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -50A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFERFOR VALEODIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -25A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFERFOR VALEODIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -35A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFER225CDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFER
             |  
                COMPONENTES Y ENSAMBLES
               |  
                  ACTRON TECHNOLOGY CORPORATION
                 |  
              2012-04-02
             |  
              China Taiwan
             |  
              5976 Kgs
             |  
              20 PCS  
             | 
| 
              10
             |  
              HLCUTPECC10361AF
             |  
              DIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -35A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFER225CDIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -50A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFERFOR VALEODIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -25A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFERFOR VALEODIODE:UNMOUNTED CHIP,DIE,WAFERPRESSFIT DIODE -35A 20-24VDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFERDIODE:UNMOUNTED CHIP,DIE,WAFER
             |  
                COMPONENTES Y ENSAMBLES
               |  
                  ACTRON TECHNOLOGY CORPORATION
                 |  
              2012-03-26
             |  
              China Taiwan
             |  
              6104 Kgs
             |  
              18 PCS  
             |