| 1 | HEICHSF32783720 | AUTOMATIC DICING SAW | GIORGIO TECHNOLOGY SALES SERVICE | YACDASTECH,INC. | 2015-05-20 | Japan | 681 Kgs | 1 CAS | 
| 2 | HEICHSF32772693 | AUTOMATIC DICING SAW                         USED DISCO | GIORGIO TECHNOLOGY SALES SERVICE | YACDASTECH,INC. | 2014-11-12 | Japan | 645 Kgs | 1 CRT | 
| 3 | HEICHSF32726924 | OPERATIONAL DISCO DICING SAW(HS NO.8486.10) | GIORGIO TECHNOLOGY SALES SERVICE | N/A | 2012-09-06 | Japan | 716 Kgs | 1 CAS | 
| 4 | HEICHSF32723693 | APP.MFG SEMICONDUCTOR BOULES & WAFERS(HS CODE: 848610) | GIORGIO TECHNOLOGY SALES SERVICE | DASTECH INTERNATIONAL ,INC 35 DALE | 2012-06-27 | Japan | 1346 Kgs | 2 CAS | 
| 5 | HEICHSF32720016 | APP.MFG SEMICONDUCTOR BOULES & WAFERS(HS CODE: 848610) | GIORGIOTECHNOLOGY SALES SERVICE | DASTECH INTERNATIONAL ,INC 35 DALE | 2012-03-30 | Japan | 1220 Kgs | 2 CAS | 
| 6 | HEICHSF06910685 | USED DISCO DICING SAW | GIORGIO TECHNOLOGY SALES SERVICE | N/A | 2010-02-16 | Japan | 1357 Kgs | 1 CAS | 
| 7 | HEICHSF06841142 | MACHINES FOR BOULES/WAFERSUSED DISCO DICING SAW | GIORGIO TECHNOLOGY SALES SERVICE | N/A | 2009-04-12 | Japan | 1309 Kgs | 1 CAS | 
| 8 | HEICHSF06839554 | USED DISCO DICING SAW | GIORGIO TECHNOLOGY SALES SERVICE | N/A | 2009-03-30 | Japan | 610 Kgs | 1 CAS | 
| 9 | HEICHSF06823815 | MACHINES FOR BOULES/WAFERSUSED DISCO DICING SAW | GIORGIOTECHNOLOGY SALES SERVICE | N/A | 2008-12-29 | Japan | 400 Kgs | 1 CRT | 
| 10 | HEICHSF06778363 | SAW/CUTTING-OFF MACH TOOL,USED | GIORGIOTECHNOLOGY SALES SERVICE | N/A | 2008-06-14 | Japan | 820 Kgs | 2 CRT |