Iec Techologies, S. De R.L. De C.V.

Name: Iec Techologies, S. De R.L. De C.V. | See Full Importer History | ImportGenius
Creator: ImportGenius
License: https://creativecommons.org/licenses/by-nc-nd/4.0/

US Customs records for Iec Techologies, S. De R.L. De C.V. in Juarez. See their past imports and exports, including shipments from Hp Inc. C/o Inventec Chongqing Co, a supplier based in China.

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Total Shipments

1,507

Trading Partners

Top Partner

HP INC C O INVENTEC CHONGQING

Ports

Top Port

Yantian

Contact Info

Iec Techologies, S. De R.L. De C.V.

Blvd. Independencia 10150 Cd. Juarez Chih. Mx. C.P. 32575 Juarez Ch 32575mexico

Iec Techologies, S. De R.L. De C.V. Records

Get a complete importer history

Updated: 2025-10-25

Total shipments from 2006-11-01 to 2025-10-27

Precise data and chart data points are only available to paid subscribers

Importer Shipments

Top Trading Partners

Legend

Top Ports

Legend

Yantian
Shanghai
Yangshan
Ningpo
Pusan

Total shipments from 2006-11-01 to 2025-10-27

Precise data and chart data points are only available to paid subscribers

Importer Shipments

#	Bill of Lading	Product	Importer	Supplier	Arrival Date	Country of Origin	Gross Weight KGS	Quantity
1	CMDUSHZ7591148	SET,DISPLAY,BEZEL,IR, SET,COVER,A,BLACK SET,POGO,RING,BLACK SET,COVER,A,BLACK SET,BUTTON,VOLUME,BLACK SET,VOLUME,BUTTON SET,AC RING,MALTA, SET,CASE,BEZEL,DISPLAY,METEOR SET,DISPLAY,BEZEL,NON AG, X IC,FLASH MEMORY, M,- + C, . . V, RESISTOR-CHIP, K, , / W, . A, ,TR SET,HOLDER,A SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , MM,MACH, . MM, . MM,CROSS,SCREW,I,M . , MM,MACH, . MM, . MM,CROSS, INSULATOR, MM, MM, . MM, D SHIELD,TOP,ABSORBER,DST- , ,MYLAR INSULATOR,PCB,L SHAPE,PC, . T, W FOAM,LED PCB,CR- , . MM COVER,TOP,POWER,PCFR E+TIO , X SET,HOUSING,BOTTOM SET,HOUSING,BOTTOMASSEMBLY,MODULE,REAR,DISPLAY,WWAN, P,IM PART NO: H H H H H H H H H H H H H H H H H H H H H H H H PO : INV: H H H HH H H H H H H H H H H H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LISTTO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC (CHONGQING)	2025-10-25	China	9844 Kgs	650 CTN
2	CMDUSHZ7594033	DIODE,ESD, . V, A,SMD,CSP P Y,TR IC,POWER SWITCH,SOT - , P,TR DIODE,ESD, . V, MA,SMD,DFN P E,TR IC,REDRIVER,DE MUX,WQFN, P,TR IC,CONTROLLER, . V,WLCSP, P,TR IC,BUCK-BOOST CONTROLLER, . V,VQFN,, CAPACITOR-CHIP, UF, V, M,X R, ,TR CAPACITOR-CHIP, UF, V, M,X R, ,TR, . INDUCTOR, . UH, , MHZ, MA, . X X . CAPACITOR-CHIP, UF, V, M,X R, ,TR, .CAPACITOR-AL, UF, V,M, C, . X , / CAPACITOR-CHIP, UF, V,K,X R, ,TR IC,USB TYPE-C PORT CONTROLLER,QFN, P,TR IC,USB CONTROLLER HUB, -PORT, USB . ,QFN, SET,HOLDER,A ASSEMBLY,CASE,TOP,NRJ, PART NO:H HH H H H H H H H H H H H H H H H H PO : INV:H H H H H H H HH H H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LISTTO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC (CHONGQING)	2025-10-25	China	13254 Kgs	653 CTN
3	CMDUSHZ7528509	ASSEMBLY,HUB,CAYMAN,ATTACHED,NO SD CAPACITOR-CHIP, PF, V,K,X R, ,TR, CONNECTOR,W TO B, . / . MM,ML,BLK, X , . CONNECTOR,W TO B, . MM,ML,BLK, X , . M CONNECTOR,B TO B, . / . MM,FL,NTU, X CONNECTOR,FPC,BACK FLIP, . / . MM,FL,B TRANSISTOR-FET,NEMOS, V, A,DFN X EP,, CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, PF, V,J,X R, ,TR CAPACITOR-CHIP- PF-K, V-X R- -TAP CAPACITOR-CHIP, PF, V,D,NP , ,TR,. CAP-CHIP- PF- V-K-X R- -TAP CAPACITOR-CHIP- . UF-M- . V-X R- -TA CAPACITOR-CHIP- . UF- . V-K-X R- -TA CAPACITOR-CHIP, . UF, V,K,X R, ,TACAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, . UF, V,K,X R, ,TR, CAPACITOR-CHIP, UF, V,M,X R, ,TR CAPACITOR-CHIP, UF, V,K,X R, ,TR, . CAPACITOR-AL-SP, UF, . V,+ /- ,- + CONNECTOR,W TO B, . / . MM,ML,BLK, X BEAD, OHM, , A,. OHM, INCH, MHZ, INDUCTOR, . UH, , KHZ, A, . X . XBEAD, OHM, , A, . OHM, INCH, MH BEAD, OHM, , A, . OHM, INCH, INDUCTOR, . UH,+/- , KHZ, A, . X . INDUCTOR, . UH,+/- , KHZ, . A, . X . CHOKE, OHM,+/- , MA, . X . X . , INDUCTOR, . UH,+/- , MHZ, A, . X . X INDUCTOR, . UH,+/- , KHZ, . A, . X BEAD, OHM, , MA, . OHM, INCHBEAD, OHM, , MA, . OHM, MM, INDUCTOR, . UH,+/- , MHZ, MA, . X BEAD, OHM, , MA, . OHM, INCH, INDUCTOR, . UH, , KHZ, . A, . X . INDUCTOR, . UH, , KHZ, A, . X . X . BEAD, OHM,+/- , A, . OHM, MM, INDUCTOR, . UH,+- , KHZ, . X . X . M INDUCTOR, UH,+- , KHZ, A, . X . X MTRANSISTOR-FET,P-CHANNEL MOSFET,- V,- TRANSISTOR-FET,NEMOS, V, A,DFN X EP, IC,FLASH MEMORY, M,- + C, . . V, SOCKET,NANO SIM, P, . MM,GOLD FLASH, . CAPACITOR-OS, UF, . V,M, C, . X . ,L CAPACITOR-CHIP, UF, V,M,X R, ,TR, . DIODE,SCH, V, MA,SMD,SOT- ,TR DIODE,ESD, . V, A,SMD,DFN - L,TRDIODE,ESD, V,SMD,WLCSP . X . - ,TR DIODE,ESD, V,SMD,WLCSP . X . - ,TR DIODE,ESD, . V,SMD,SLP P X J,TR CONNECTOR,FPC,BACK FLIP, . MM,FL,WHT, X RESISTOR-M/F, . , , W, ,TR TRANSISTOR-FET,NEMOS, V, MA,SC- , P, TRANSISTOR-FET,PEMOS,- V,- . A,SOT , P TRANSISTOR-FET,DUAL NMOSFET, V, . A,SOIC,POWER SWITCH,SOT , P,TR IC,TEMPERATURE SENSOR,MSOP, P,TR IC,USB TYPE-C PD CONTROLLER, . V,VQFN, IC,SYNC STEP-DOWN REGULATOR, . VV, DIODE,SCH, V, MA,SMD,SOT- ,TR TRANSISTOR-FET,NEMOS, V, MA,SOT- , P TRANSISTOR-FET,PEMOS,- V,- A,PDFN X P SET,BOTTOM COVER,ASET,BCS,LENS,D,PMMA SET,A COVER,DOOR,W/O FINGER,W/O PAYMENT, SET,BEZEL STANDOFF,FF,M . , . MM, . MM,RND,SN, . STANDOFF,FF,M . , . MM, . MM,RND,SN, . STANDOFF,FF,M . , . MM, . MM,RND,SN, . CLIP, . MM, . MM, . MM,SUS / H,H= CLIP,PCB, . MM, MM, . MM,SUSFOAM,P , MM, MM, . MM,THICK FOAM,CR , MM, MM, . MM,WWAN -ROLL S BUMPER, . MM, . MM, . MM,SILICONE RUBB BUMPER, MM, . MM, . MM,SILICONE RUBBER INSULATOR,BRKT CPU,AMD,TS- -HB, FFC, P CLICK, X . X . MM, . / . MM,PET FFC, P ECOM, X . X . MM, . / . MM,PET, SPEAKER.W/HOUSING, OHM, W, X , X . XBUTTON,BOTTOM COVER,PC+ABS+ TALC LATCH,BOTTOM COVER,POM LENS,BCS,WINDOW,PMMA,TOP DOOR,DUMMY,SIM,C ,WHITE LENS,BCS,WINDOW,PMMA,BOT CABLE,ROUND+FPC, POS, MM,I,EDP,TOP,PR SPEAKER.W/HOUSING, OHM, W, X , . X DOOR,DUMMY,SIM,C ,BLACKHOLDER,CAMERA,PC+ABS FRAME,TOP,POWER,PCFR E, DUMMY,TOP,PEN,PC+ABS+ TALC, X BRACKET,THERMAL,CPU,SUS BRACKET,TOP,KEYBOARD,SGCC, COVER,DISPLAY HINGE,LEFT,RAL T , X COVER,DISPLAY HINGE,RIGHT,RAL T , X SHIELD,ASIDE,ABSORBER,DST- , ,MYLARPCB,LAN, L,FR ,HALOGEN FREE+ ROHS PCB,MB, L,FR ,HALOGEN FREE+ ROHS PCB,HUB, L, . X X . MM,FR ,HALOGEN FRE PCB,SC, L, . X . X . MM,FR ,HALOGEN FR PCB,USB, L,FR ,HALOGEN FREE+ ROHS PCB,ECOM, L, . X X . MM,FR ,HALOGEN FRE TRANSISTOR-FET,PEMOS,- V,- A,PDFN X P ASSEMBLY,HOLDER,PCBASSEMBLY,HOLDER,PCB ASSEMBLY,CASE,BOTTOM,SUB,NRJ THIN- , PART NO: H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HPO : INV: H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H HHS CODE: CARTONS INTO PALLETSHPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATIONARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	N/A	2025-10-12	China	9692 Kgs	609 CTN
4	CMDUSHZ7461581	ASSEMBLY,TOP,THICK,KEYBOARD, SUB,AI+ NON ASSEMBLY,TOP,THICK RJ , KEYBOARD,SUB,PCB ASSEMBLY,MODULE,REAR,DISPLAY, WLAN PCB , PART NO:H H, H H H H PO : INV:H H H H HH HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BBTO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATESAMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC (CHONGQING)	2025-09-04	China	6462 Kgs	486 CTN
5	CMDUSHZ7461583	ASSEMBLY,CASE,BOTTOM,SUB, NRJ THIN, N ASSEMBLY,CASE,BOTTOM,SUB, NRJ THIN, N ASSEMBLY,MODULE,REAR,DISPLAY, WLAN, P,IM ASSEMBLY,MODULE,REAR,DISPLAY,, WLAN, P,IM ASSEMBLY,MODULE,REAR,DISPLAY, WLAN, P,IM PART NO:H H H H H PO : INV:H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USABY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC (CHONGQING)	2025-09-04	China	7595 Kgs	488 CTN
6	CMDUSHZ7461579	RESISTOR-CHIP, K, , / W, ,TR IC,HUB CONTROLLER,USB . , QFN, P,TR TRANSISTOR-FET,PEMOS, V, MA,SOT , P, DIODE,SCH, V, . A, MW,SMT,, SOT- ,TR BEAD, OHM, , . A, . OHM, INCH, IC,THERMAL SENSOR,ONE, BIT ADC,SOT- , P IC,TEMPERATURE SENSOR, SOT - , P,TR IC,PROTECTION DEVICE,ESD, V,DFN X - L, DIODE-ZNR, . V, . MA, MW,SMD, SOD ,TR TRANSISTOR-FET,PEMOS,- V,- A, DFN X , P DIODE,ESD, V, A, W,SMD, SLP P X F,TR DIODE,ESD, . V, A,SMD,DFN P E,TRDIODE,ESD, . V,SMD,DFN P X,TR IC,ANALOG SWITCH,UQFN, P,TR ASSEMBLY,CASE,BOTTOM,SUB, RJ THICK, W ASSEMBLY,TOP,THICK,KEYBOARD, SUB,AI+ NON PART NO:H H H HH H H H H H H H H H H H H H H PO : INV:H H H H H H H H H HH H H H H H H H H HS CODE: CARTONS INTO PALLETSHPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATIONARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC (CHONGQING)	2025-09-04	China	6360 Kgs	508 CTN
7	CMDUCHN2529205	SET,BEZEL,DISPLAY,IR, W SET,BEZEL,DISPLAY, W,IR CABLE,ROUND, POS, MM,E,MDP TO DP ADAP FAN,BLOWER, . X . X . MM, . CFM, . FRAME,TOP,KEYBOARD,PC+ABS+ TALC,US, ASSEMBLY,MODULE,REAR,DISPLAY,WLAN, P,IM ASSEMBLY,CASE,BOTTOM,W/O,RJ , N, PART NO: H H H H H H H H H PO :INV: H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALSALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT.NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC (CHONGQING)	2025-09-04	China	6745 Kgs	22 PKG
8	CMDUCHN2529193	ASSEMBLY,TOP,THICK RJ ,KEYBOARD,SUB,PCB ASSEMBLY,CASE,BOTTOM,W/O,RJ , N FUSE,POLYMER, . A, V,SMD, . X . ,TR STANDOFF,FF,M . , . MM, . MM,RND,SN, . STANDOFF,FF,M . , . MM, . MM,RND,SN, . STANDOFF,FF,M . , . MM, . MM,RND,SN, MM CLIP, . MM, . MM, . MM,SUS / H,H= ., CLIP, . MM, . MM, . MM,SUS / H,H= FRAME,SHIELDING,C ,R SHIELD,CPU INL,KU S, N, SHIELD,CPU INL,KU S, N, CABLE,ROUND, POS, MM,E,TBT COMBO PCB,SMART CARD, L,HALONGFREE,ENTEK PCB,ECOM, L,FR ,ENTEK PART NO:H H H H H H H H H H H H H H H H H PO : INV: H H H H H HH H H H H H H H H H H HS CODE: CARTONS INTO PALLETSHPI-IMX - RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATIONARRANGEMENT. NOTIFY :HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC (CHONGQING)	2025-09-04	China	6776 Kgs	23 PKG
9	CMDUCHN2529191	SET,BEZEL,DISPLAY,IR, P SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X FUSE,POLYMER, . A, V,SMD, . X . ,TR STANDOFF,FF,M . , . MM, . MM,RND,SN, . CLIP, . MM, . MM, . MM,SUS / H,H= BRACKET,TOP,SMART CARD,KU S,AUTO, TOUCH PAD,NO BUTTON, P, . X ,PIKE SIL SPEAKER.W/HOUSING, OHM, . W, X , . X HINGE-W BRACKET,DISPLAY,LEFT, . . KGF- HINGE-W BRACKET,DISPLAY,RIGHT, . . KGF SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , X . KEYBOARD MODULE, ,USB,JACK BLACK,US, SPEAKER.W/HOUSING, OHM, W, X , . XSPEAKER.W/HOUSING, OHM, W, X , . X SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X .SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X SPEAKER.W/HOUSING, OHM, W, X , . X SPEAKER.W/HOUSING, OHM, W, X , . X . SPEAKER.W/HOUSING, OHM, W, X , . X . THERMAL MODULE,INTEL ARL,UMA, W,CHIPSET SET,TOP,HOUSING SET,FRAME,BTM,MWSSET,BEZEL,DISPLAY,IR, P DUMMY,SMART CARD,TOP,PC+ABS+ TALC, FRAME,TOP,KEYBOARD,PC+ABS+ TALC,UK, HOLDER,BOTTOM IO,RIGHT,PC+ABS+ TALC, HOLDER,TOP,IO R,PC+ABS TALC, P BUTTON,TOP FPR,PC, P FAN,BLOWER, . . . MM, . CFM, . SCREW,I,M . , . MM,MACH, . MM, . MM,CROSSCREW,I,M . , . MM,MACH, . MM,. MM,CROSS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROSSCREW,PAN,M . , . MM,MACH, . MM, . MM,CR SCREW,I,M . , MM,MACH, . MM, . MM,CROSS, SCREW,I,M . , . MM,MACHINE, . MM, . MM, SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS PAD, MM, MM, . MM,DENKA BSNA SHIELD,PCB,MAIN,ABSORBER, GASKET,CF, MM, MM, MM,CONDUCTIVE,ADHESIGASKET,CF, MM, MM, MM,CONDUCTIVE,ADHESI GASKET,CF, MM, MM, MM,CONDUCTIVE,ADHESI CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, PF, V,J,C G, ,TR,. CAPACITOR-TA-SP, UF, . V,M,- + C, DIODE,RECT, V, A,SMD,SOD- FL,TR RESISTOR-CHIP, , , / W, ,TRRESISTOR-CHIP, , , / W, ,TR RESISTOR-CHIP, . K, , / W, ,TR RES-CHIP- . K- - / W- -TAP RES-CHIP- K- - / W- -TAP RESISTOR-CHIP, . K, , / W, ,TAP RESISTOR-CHIP, . K, , / W, ,TR RESISTOR-CHIP, . , , / W, ,TR RESISTOR-CHIP, , , / W, ,TRRESISTOR-CHIP, K, , / W, ,TR RESISTOR-CHIP, K, , / W, ,TR RESISTOR-CHIP, K, , / W, ,TR RESISTOR-CHIP, . K, , / W, ,TR RESISTOR-CHIP, , , / W, ,TR RESISTOR-CHIP, K, , / W, . A, ,TR RESISTOR-CHIP, ,+/- , / W, ,TR RESISTOR-CHIP, ,+/- , / W, ,TAPRESISTOR-CHIP, . K,+/- , / W, ,TAP RESISTOR-CHIP, . K,+/- , / W, ,TAP RESISTOR-CHIP, K,+/- , / W, ,TAP RESISTOR-CHIP, ,+/- , / W, ,TR,+/- RESISTOR-CHIP, ,+/- , / W, ,TR,+/ RESISTOR-CHIP, . ,+/- , W, ,TR,+/- RESISTOR-CHIP, . K,+/- , / W, ,TR INDUCTOR, . UH, , KHZ, A, . X XBEAD, OHM, , A, . OHM, INCH, MH BEAD, OHM, , A, . OHM, INCH, M INDUCTOR, . UH,+/- , KHZ, . A, . X . BEAD, OHM, , A, . OHM, INCH, INDUCTOR, . UH,+- , KHZ, A, . X . INDUCTOR, . UH,+- , KHZ, . A, . X . CRYSTAL, MHZ, PPM, PF,SMD, . X . X . CRYSTAL, . KHZ,+/- PPM, . PF,SMD, .CRYSTAL, MHZ,+/- PPM, PF,SMD, . X . X CRYSTAL, . MHZ,+/- PPM, PF,SMD, . X . IC,STEP DOWN CONVERTER, . . V, . MHZ,V IC,FLASH MEMORY, M,- + C, . . V, IC,STEP DOWN CONVERTER, . . V, . MHZ,V IC,TEMPERATURE SENSOR, . . V,VSSOP, P CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP,. UF, . V,M,X R, ,TRCAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, . UF, . V,K,X R, ,TR CAPACITOR-CHIP, . PF, V,C,C G, ,TR, CAPACITOR-CHIP, PF, V,J,C G, ,TR, . CAPACITOR-CHIP, . UF, . V,M,X R, ,TR CAPACITOR-CHIP, . UF, V,K,X R, ,TR DIODE,RECT, V, A,SMD,SOD- FL,TR CONNECTOR,W TO B, . / . MM,ML,BLK, X , .BEAD- OHM- - . A- . OHM- INCH- INDUCTOR, . UH,+/- , KHZ, A, . X INDUCTOR, . UH,+/- , KHZ, . A, . X . INDUCTOR, . UH,+- , KHZ, A, . X . INDUCTOR, . UH,+/- , KHZ, A, . X . INDUCTOR, . UH,+- , KHZ, A, X . X INDUCTOR, . UH,+- , MHZ, A, . X . X TRANSISTOR-FET,NEMOS, V, A,DFN X , P,IC,FLASH MEMORY, M,- + C, . . V, CONNECTOR,W TO B, . / . MM,ML,BLK, X , . TRANSISTOR-FET,PEMOS,- V, A,SOT- , P,T IC,ANALOG MUX/DEMUX,X - DFN - , P,TR DIODE,ESD, V,SMD,SOD ,TR CONNECTOR,W TO B, . / . MM,ML,BLK, X , . CONNECTOR,FPC,BACK FLIP, . / . MM,FL,NTU RESISTOR-CHIP, . ,+- , W, ,TRRESISTOR-CHIP, . ,+/- , W, ,TR,+- IC,MICROPOWER HALL SWITCH,TSOT - L, P,T IC,AND GATE, . . V, INPUT,SINGLE,TSSO BEAD, OHM, , MA, . OHM, INCH, IC,TEMPERATURE SENSOR,MSOP, P,TR ASSEMBLY,CASE,BOTTOM,SUB,NRJ THIN- , PART NO: H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H PO : INV: H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HHS CODE: CARTONS INTO PALLETS( PALLETS + CARTONS) HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LISTTO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC (CHONGQING)	2025-09-04	China	8350 Kgs	26 PKG
10	CMDUCHN2529218	SCREW,I,M . , . MM,P, . MM, . MM,TORX/SL FRAME,BOTTOM,LNL-SUP,PC+ABS TALC, P FRAME,BOTTOM,LNL,SUP,PC+ABS TALC, ,Z DUMMY,SMART CARD,TOP,PC+ABS, + TALC, W BUTTON,TOP,POWER,PCFR E+TIO , GRAY SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SHIELD,CAN DDR,WLAN, SUS , W THERMAL MODULE,AMD FP , W,CHIPSET DOWN BRACKET,TOP,KEYBOARD,SGCC, LNL MOUSE,USB, B+WHEEL,OPTICAL, BLACK TOUCH PAD,NO BUTTON, P, X . ,PIKE S KEYBOARD, ,BL, P,SOFT GREY,USA, . X KEYBOARD, ,BL, P,BLACK,CAN-FR / MULTI,ASSEMBLY,MODULE,REAR,DISPLAY,WLAN, P,IM ASSEMBLY,MODULE,REAR,DISPLAY,WLAN, P,IM ASSEMBLY,MODULE,REAR,DISPLAY,WLAN, P,IM TRANSISTOR-FET,NNEMOS, V, / A,DFN, P, CAPACITOR-CHIP, UF, . V,M,X R, ,TR, CAPACITOR-TA-SP, UF, V,M, C,BX . ,SM IC,PWM CONTROLLER, . - . V, KHZ- MHZ,T IC,REPEATER/LEVEL SHIFTER, . GBPS,HDMI,IC,PROTECTION DEVICE, V,FLAT-CLAMP SURG IC,LOAD SWITCH, . . V, A,DSBGA, P,TR IC,TEMPERATURE SENSOR, . . V,VSSOP, P, CAPACITOR-CHIP, PF, V,K,NP , ,TR CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, . UF, V,K,X R, ,TR CAPACITOR-CHIP, UF, V,K,X S, ,TR, . CAPACITOR-CHIP, . UF, . V,M,X R, ,TRCAPACITOR-CHIP, . UF, . V,M,X R, ,TR, CAPACITOR-CHIP, . PF, V,B,C G, ,TR, CAPACITOR-CHIP, UF, . V,M,X R, ,TR, CAPACITOR-CHIP, . UF, . V,M,X R, ,TR, CAPACITOR-CHIP, PF, V,K,X R, ,TR CAPACITOR-CHIP, . UF, V,K,X R, ,TR CAPACITOR-CHIP, PF, V,J,C G, ,TR, CAPACITOR-CHIP, PF, V,J,C G, ,TR,CAPACITOR-CHIP, . UF, V,K,X R, ,TR CAPACITOR-CHIP, . UF, . V,M,X R, ,TR, CAPACITOR-CHIP, PF, V,C,C G, ,TR, . INDUCTOR, . UH, , KHZ, A, . X X BEAD, OHM, , A, . OHM, INCH, MH BEAD, OHM, , A, . OHM, INCH, M BEAD, OHM, , MA, . OHM, INCH, INDUCTOR, . UH,+/- , MHZ, MA, . X .INDUCTOR, . UH,+/- , MHZ, . A, . X . INDUCTOR, . UH,+/- , MHZ, . A, . X . X INDUCTOR, . UH,+- , KHZ, A, . X . X INDUCTOR, . UH,+/- , MHZ, A, . X . X INDUCTOR, . UH,+- , MHZ, . A, . X . X INDUCTOR, . UH,+- , MHZ, A, . X . X . INDUCTOR, . UH,+- , KHZ, A, . X . X BEAD, OHM, , A, . OHM, INCH,IC,FLASH MEMORY, M,- + C, . . V, IC,PWM CONTROLLER, . - . V, KHZ- MHZ,T IC,TEMPERATURE SENSOR, . . V,VSSOP, P CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP,. UF, . V,M,X R, ,TR CAPACITOR-CHIP, PF, V,J,C G, ,TR CAPACITOR-CHIP, . UF, . V,K,X R, ,TR CAPACITOR-CHIP, . PF, V,C,C G, ,TR,CAPACITOR-CHIP, PF, V,J,C G, ,TR, . CAPACITOR-CHIP, . UF, . V,M,X R, ,TR CAPACITOR-CHIP, . UF, V,K,X R, ,TR BEAD- OHM- - . A- . OHM- INCH- INDUCTOR, . UH,+/- , KHZ, A, . X INDUCTOR, . UH,+/- , KHZ, . A, . X . INDUCTOR, . UH,+- , KHZ, A, . X . INDUCTOR, . UH,+/- , KHZ, A, . X .INDUCTOR, . UH,+- , KHZ, A, X . X INDUCTOR, . UH,+- , MHZ, A, . X . X IC,FLASH MEMORY, M,- + C, . . V, IC,TEMPERATURE SENSOR,MSOP, P,TR CAPACITOR-TA-SP, UF, . V,M,- + C, HINGE-W BRACKET,DISPLAY,LEFT, . MM, . HINGE-W BRACKET,DISPLAY,RIGHT, . MM, . HOLDER,BOTTOM IO,RIGHT,PC+ABSFAN,BLOWER, X X . MM, . CFM, . PA, MOUSE,USB, BUTTON,OPTICAL,BLACK PLATE,BACKING,CPU,SGCC BRACKET,MEMS,MIC,SGCC COVER,DISPLAY HINGE,LEFT,RAL T , X COVER,DISPLAY HINGE,RIGHT,RAL T , X COVER,DISPLAY HINGE,LEFT,RAL ,WLAN, COVER,DISPLAY HINGE,RIGHT,RAL ,WLAN,HINGE-W BRACKET,DISPLAY,LEFT, . . KGF- HINGE-W BRACKET,DISPLAY,RIGHT, . . KGF DIB,PEN,BLACK CABLE,ROUND, POS, MM,I,BASE GPIO CABLE,ROUND+FPC, POS, MM,I,HUB CABLE,FLAT, POS, MM,I,BASE HIGH SPEED CABLE,ROUND+FFC, POS, MM,I,CAMERA,ACS CAPACITOR-TANT, UF, V, ,- + C, .PART NO: H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H PO : INV: H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H HH H H H H H H H H H H H H H H H H H H H H H H HS CODE: CARTONS INTO PALLETS ( PALLETS + CARTONS) HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USAAS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTACLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E.IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -	IEC TECHOLOGIES, S. DE R.L. DE C.V.	HP INC. C/O INVENTEC (CHONGQING)	2025-09-04	China	8962 Kgs	22 PKG

#	Importer	Last Address	Most Recent

#	Supplier	Last Address	Most Recent	No. of Containers	Gross Weight KGS
1	HP INC C O INVENTEC CHONGQING	China	2025-10-25	1071	5314140
2	INVENTEC CHONGQING CO LTD	China	2025-04-16	198	1117672
3	HP INC O B INVENTEC CHONGQING	China	2025-08-28	76	582936
4	FULIAN PRECISION ELECTRONICS TIANJ	South Korea	2024-04-13	44	53960
5	HP INC C O INVENTEC CORPORATION	China	2024-12-27	38	174360

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Sample Shipment From Iec Techologies, S. De R.L. De C.V.

Bill of Lading CMDUSHZ7591148

Arrival Date: 2025-10-25

Container Number: ECMU7144706

Cargo #1
Description SET,DISPLAY,BEZEL,IR, SET,COVER,A,BLACK SET,POGO,RING,BLACK SET,COVER,A,BLACK SET,BUTTON,VOLUME,BLACK SET,VOLUME,BUTTON SET,AC RING,MALTA SET,CASE,BEZEL,DISPLAY,METEOR SET,DISPLAY,BEZEL,NON AG, X IC,FLASH MEMORY, M,- + C, . . V, RESISTOR-CHIP, K, , / W, . A, ,TR SET,HOLDER,A SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , . MM,MACH, . MM, . MM,CROS SCREW,I,M . , MM,MACH, . MM, . MM,CROSS, SCREW,I,M . , MM,MACH, . MM, . MM,CROSS, INSULATOR, MM, MM, . MM, D SHIELD,TOP,ABSORBER,DST- , ,MYLAR INSULATOR,PCB,L SHAPE,PC, . T, W FOAM,LED PCB,CR- , . MM COVER,TOP,POWER,PCFR E+TIO , X SET,HOUSING,BOTTOM SET,HOUSING,BOTTOM ASSEMBLY,MODULE,REAR,DISPLAY,WWAN, P,IM PART NO: H H H H H H H H H H H H H H H H H H H H H H H H PO : INV: H H H H H H H H H H H H H H H H H H H H H H H H HS CODE: CARTONS INTO PALLETS HPI-IMX-RAW MATERIALS ALL CHARGES COLLECT AT USA BY HP USA AS THIS IS SPECIAL ARRANGE, PLEASE TAKE THE REMARK FOR BB TO INVENTEC MEXICO ON BL.ALSO, PLEASE GIVE THE SPECIAL LIST TO REGION FOR DESTINATION ARRANGEMENT. NOTIFY : HP INC. PAGE MILL ROAD SANTA CLARA PALO ALTOUNITED STATES AMS.OCEAN.PREALERT HP.COM ( ) - TEL : - ( ) - / - - ND NOTIFY:SAMSUNG SDS AMERICA, INC. E. IMPERIAL HIGHWAY, SUITE F , SANTA FE SPRING LA.OPERATION SAMSUNG.COM JUN YEON KIM - -
Keywords set display	HS-Code DATA UNAVAILABLE	Piece Count 650

Length 480	Height 108
Width 96	Load Status Loaded
Seal M5738778	Equipment Description CN
Type 40 Foot Dry Container, Opening at one or both end	Type of Service Pier to Pier
Container Type 40 Foot Dry Container, Opening at one or both end	Marks & Numbers N/M

Carrier COMPAGNIE MARITIME D-AFFRETEMENT	Carrier Code CMDU
Carrier Address 5701 LAKE WRIGHT DR	Carrier Contact Number DATA UNAVAILABLE
Ship Registered In DATA UNAVAILABLE	Foreign Port YANTIAN
Voyage Number 0TXLE	Country of Origin CHINA
Vessel Name CMA CGM MEDEA	U.S. Port DATA UNAVAILABLE
Master Bill of Lading CMDUSHZ7591148	Weight (LB/KG) 21706.02 / 9844
Quantity 650 CTN	Container Count 1
Place of Receipt YANTIAN	Distribution Port DATA UNAVAILABLE
House-v-Master DATA UNAVAILABLE	Measurement DATA UNAVAILABLE
In-Bond Entry-Type 61	Bill Type Code In-bond Automated