|
1
|
DMALSZXD11156
|
COPPER & ALUMINUM HEAT SINK FOR SERVER THERMAL DISSIPATION
|
EMC CORPORATION
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-10-17
|
China
|
301 Kgs
|
33 CTN
|
|
2
|
DMALHKGC56714
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-10-10
|
Hong Kong
|
244 Kgs
|
58 CTN
|
|
3
|
DMALHKGC56186
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-10-06
|
Hong Kong
|
198 Kgs
|
28 CTN
|
|
4
|
DMALHKGC55716
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-10-02
|
Hong Kong
|
421 Kgs
|
37 CTN
|
|
5
|
DMALHKGC54590
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-09-07
|
Hong Kong
|
204 Kgs
|
14 CTN
|
|
6
|
DMALSZXC95636
|
HEAT SINK
|
DANFOSS DRIVES
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-08-21
|
China
|
4170 Kgs
|
10 PKG
|
|
7
|
DMALSZXD00414
|
HEAT SINK
|
BOYD CORPORATION
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-08-03
|
China
|
1560 Kgs
|
182 CTN
|
|
8
|
DMALHKGC50514
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-08-02
|
Hong Kong
|
251 Kgs
|
19 CTN
|
|
9
|
DMALHKGC51460
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-08-02
|
China
|
4550 Kgs
|
508 CTN
|
|
10
|
DMALSZXC98176
|
COPPER & ALUMINUM HEAT SINK FOR SERVER THERMAL DISSIPATION
|
EMC CORP
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-07-28
|
China
|
614 Kgs
|
67 CTN
|