|
1
|
DMALSZXD17691
|
HEAT SINK
|
DANFOSS DRIVES
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-12-05
|
China
|
283 Kgs
|
1 PKG
|
|
2
|
DMALHKGC59164
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-11-28
|
Hong Kong
|
189 Kgs
|
27 CTN
|
|
3
|
DMALHKGC58123
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-11-20
|
Hong Kong
|
1402 Kgs
|
155 CTN
|
|
4
|
DMALHKGC58705
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-11-20
|
Hong Kong
|
1590 Kgs
|
204 CTN
|
|
5
|
DMALSZXD13019
|
COPPER & ALUMINUM HEAT SINK FOR SERVER THERMAL DISSIPATIONHS: INV NO # PLTS= CTNS
|
EMC CORP
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-11-02
|
China
|
597 Kgs
|
84 CTN
|
|
6
|
DMALHKGC57774
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-11-02
|
Hong Kong
|
2170 Kgs
|
224 CTN
|
|
7
|
DMALSZXD11156
|
COPPER & ALUMINUM HEAT SINK FOR SERVER THERMAL DISSIPATION
|
EMC CORPORATION
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-10-17
|
China
|
301 Kgs
|
33 CTN
|
|
8
|
DMALHKGC56714
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-10-10
|
Hong Kong
|
244 Kgs
|
58 CTN
|
|
9
|
DMALHKGC56186
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-10-06
|
Hong Kong
|
198 Kgs
|
28 CTN
|
|
10
|
DMALHKGC55716
|
HEAT SINK
|
FUTURE ELECTRONICS
|
BOYD (SHENZHEN) SYSTEMS CO.,LTD
|
2025-10-02
|
Hong Kong
|
421 Kgs
|
37 CTN
|