| 
              1
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              THERMAL CURABLE MARKING INK USED FOR PCB (KSM-388W) THERMAL CURABLE MARKING INK USED FOR PCB (KSM-388W)
             |  
                FINELINE CIRCUIT COMPANY
               |  
                  JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW-MATERIALS S
                 |  
              2025-06-28
             |  
              CHINA
             |   
              10 KGS
             | 
| 
              2
             |   
              LIQUID PHOTOIMAGEABLE SOLDER MASK WITH HARDENER KSM 19-H01 (750+250GMS) USED FOR PCB (KSM-S6189R03)LIQUID PHOTOIMAGEABLE SOLDER MASK WITH HARDENER KSM 19-H01 (
             |  
                FINELINE CIRCUIT COMPANY
               |  
                  JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW-MATERIALS S
                 |  
              2025-06-28
             |  
              CHINA
             |   
              30 KGS
             | 
| 
              3
             |   
              LIQUID PHOTOIMAGEABLE SOLDER MASK WITH HARDENER KSM 19-H01 (750+250GMS) USED FOR PCB (KSM-S6189KM01)LIQUID PHOTOIMAGEABLE SOLDER MASK WITH HARDENER KSM 19-H01 (
             |  
                FINELINE CIRCUIT COMPANY
               |  
                  JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW-MATERIALS S
                 |  
              2025-06-28
             |  
              CHINA
             |   
              100 KGS
             | 
| 
              4
             |   
              LIQUID PHOTOIMAGEABLE SOLDER MASK WITH HARDENER KSM 19-H01 (750+250GMS) USED FOR PCB (KSM-S6189GM67)LIQUID PHOTOIMAGEABLE SOLDER MASK WITH HARDENER KSM 19-H01 (
             |  
                FINELINE CIRCUIT COMPANY
               |  
                  JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW-MATERIALS S
                 |  
              2025-06-28
             |  
              CHINA
             |   
              10 KGS
             | 
| 
              5
             |   
              LIQUID PHOTOIMAGEABLE SOLDER MASK WITH HARDENER KSM 19-H01 (750+250GMS) USED FOR PCB (KSM-S6189GL05-1)LIQUID PHOTOIMAGEABLE SOLDER MASK WITH HARDENER KSM 19-H01 (
             |  
                FINELINE CIRCUIT COMPANY
               |  
                  JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW-MATERIALS S
                 |  
              2025-06-28
             |  
              CHINA
             |   
              1000 KGS
             | 
| 
              6
             |   
              LIQUID PHOTOIMAGEABLE SOLDER MASK WITH HARDENER KSM 19-H01 (750+250GMS) USED FOR PCB (KSM-S6189EWT34)LIQUID PHOTOIMAGEABLE SOLDER MASK WITH HARDENER KSM 19-H01 (
             |  
                FINELINE CIRCUIT COMPANY
               |  
                  JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW-MATERIALS S
                 |  
              2025-06-28
             |  
              CHINA
             |   
              20 KGS
             | 
| 
              7
             |   
              LIQUID PHOTOIMAGEABLE SOLDER MASK WITH HARDENER KSM 19-H01 (750+250GMS) USED FOR PCB (KSM-S6189BL4)LIQUID PHOTOIMAGEABLE SOLDER MASK WITH HARDENER KSM 19-H01 (
             |  
                FINELINE CIRCUIT COMPANY
               |  
                  JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW-MATERIALS S
                 |  
              2025-06-28
             |  
              CHINA
             |   
              100 KGS
             | 
| 
              8
             |   
              LIQUID PHOTOIMAGEABLE SOLDER MASK WITH HARDENER KSM 19-H01 (750+250GMS) USED FOR PCB (KSM-S6189BK31)LIQUID PHOTOIMAGEABLE SOLDER MASK WITH HARDENER KSM 19-H01 (
             |  
                FINELINE CIRCUIT COMPANY
               |  
                  JIANGSU KUANGSHUN PHOTOSENSITIVITY NEW-MATERIALS S
                 |  
              2025-06-28
             |  
              CHINA
             |   
              30 KGS
             | 
| 
              9
             |   
              GLASS EPOXY COPPER CLAD LAMINATES FR-4 3.2MM H/H 43"X49" (QTY:19 SHTS)GLASS EPOXY COPPER CLAD LAMINATES FR-4 3.2MM H/H 43"X49" (QT
             |  
                FINELINE CIRCUIT COMPANY
               |  
                  HUA ZHENG NEW MATERIAL (HONG KONG) LIMITED.
                 |  
              2025-06-18
             |  
              CHINA
             |   
              19 NOS
             | 
| 
              10
             |   
              GLASS EPOXY COPPER CLAD LAMINATES FR-4 3.2MM H/H 37"X49" (QTY:20 SHTS)GLASS EPOXY COPPER CLAD LAMINATES FR-4 3.2MM H/H 37"X49" (QT
             |  
                FINELINE CIRCUIT COMPANY
               |  
                  HUA ZHENG NEW MATERIAL (HONG KONG) LIMITED.
                 |  
              2025-06-18
             |  
              CHINA
             |   
              20 NOS
             |