| 1 | HYSLFSZX11101215 | PLASTIC BOX FOR IC WAFER SHIPMENT WITHFOAM TYVEK | INTEGRATED DEVICE TECHNOLOGY,INC. | EPAK MULTI PRODUCTS FACTORY | 2011-11-06 | China | 1602 Kgs | 229 CTN | 
| 2 | HYSLFSZX11050021 | PLASTIC BOX FOR IC WAFER | INTEGRATED DEVICE TECHNOLOGY INC | EPAK MULTI PRODUCTS FACTORY | 2011-05-23 | China | 1279 Kgs | 182 CTN | 
| 3 | PSLAMGSOAK15060 | MACHINE PARTS-ATE RECEIVER ARM-DC SOURCE XFR 60-20-SYSTEM DC ELECTRONIC LOAD HP6050A-TRIPPLE OUTPUT DC POWER SUPPLY | INTEGRATED DEVICE TECHNOLOGY, INC | Integrated Device Technology (M) | 2011-03-30 | Singapore | 500 Kgs | 1 CRT | 
| 4 | HYSLFSZX10120938 | PLASTIC BOX FOR IC WAFER SHIPMENT FOAM TYVEK | INTEGRATED DEVICE TECHNOLOGY INC | EPAK TECHNOLOGIES(SHENZHEN)CO.,LTD | 2011-01-16 | China | 1863 Kgs | 275 CTN | 
| 5 | HYSLFSZX10070376 | FOAM DISC TYVEK | INTEGRATED DEVICE TECHNOLOGY INC | EPAK TECHNOLOGIES(SHENZHEN)CO.,LTD | 2010-08-01 | China | 915 Kgs | 137 CTN | 
| 6 | HYSLFSZX10020049 | PLASTIC BOX FOR IC WAFER SHIPMENT WITH FOAM | INTEGRATED DEVICE TECHNOLOGY INC | EPAK MULTI PRODUCTS FACTORY | 2010-02-24 | China | 3046 Kgs | 446 CTN | 
| 7 | HYSLFSZX09110263 | PLASTIC BOX FOR IC WAFER SHIPMENT WITH FOAM304CTNS IN 10 PLASTIC PALLETS | INTEGRATED DEVICE TECHNOLOGY INC | EPAK MULTI PRODUCTS FACTORY | 2009-11-29 | China | 2006 Kgs | 304 CTN | 
| 8 | HYSLFSZX09090218 | PLASTIC BOX FOR IC WAFER SHIPMENT WITH FOAM | INTEGRATED DEVICE TECHNOLOGY INC | EPAK MULTI PRODUCTS FACTORY | 2009-09-27 | China | 1141 Kgs | 164 CTN | 
| 9 | ANQISZX090001327 | PLASTIC BOX FOR IC  WAFER SHIPMENT WITH FOAMSAME | INTEGRATED DEVICE TECHNOLOGY, INC. | EPAK MULTI PRODUCTS FACTORY | 2009-03-25 | China | 1130 Kgs | 164 CTN | 
| 10 | ANQISZX081251767 | PLASTIC BOX FOR IC WAFER SHIPMENT WITH FOAMSAME | INTEGRATED DEVICE TECHNOLOGY INC. | EPAK MULTI PRODUCTS FACTORY | 2008-12-28 | South Korea | 1134 Kgs | 164 CTN |